JX Advanced Metals Materials Used in Process Development for Advanced Packaging With Glass Substrates

According to ITmedia, JX Advanced Metals announced on November 11, 2026, that materials from its group were used in a next-generation semiconductor packaging development project under Hi-CHIP, established by Taiwan’s Industrial Technology Research Institute (ITRI). The packaging technologies use glass interposers or glass cores, and the materials used were the company’s sputtering targets for semiconductors and conductive paste from group company Tatsuta Electric Wire & Cable.

The use of materials from the JX Advanced Metals group in seed-layer formation for glass interposers and processes related to TGVs in glass cores concretely demonstrates the role of materials suppliers in advanced packaging development. Mass-production adoption and performance have not been confirmed, and process conditions and evaluation results are needed to assess commercialization.

The focus of this development is that materials from the JX Advanced Metals group were incorporated into processes for advanced packaging using glass substrates. The sputtering targets were reportedly used to form seed layers on interposers, while the conductive paste was used in a process related to TGVs in glass cores. Rather than simply supplying materials, the development identified materials related to thin-film formation and through-glass vias within packaging processes that connect dissimilar materials. However, this information concerns the process-development stage and does not indicate mass-production adoption or product performance. The article reports that participants in the framework include Intel, ASML Holding and Applied Materials, in addition to ITRI. The participation of a materials supplier in a development environment involving multiple semiconductor-related companies shows that the success of packaging technology depends not only on chips themselves but also on combinations of materials and processes used for substrates, wiring and bonding. In addition to the materials’ properties, a key consideration for commercialization is whether they can be made compatible with other processes, including deposition and TGV formation. In a separate development involving Intel, Physical AI News reported on the development of a reference system for connecting sensors in Intel and Altera jointly develop a reference system for sensor connectivity aimed at physical AI. That work concerns system-level connectivity for robots and other applications, while the current development concerns materials and processes for glass-substrate packaging, a different layer of technology. There is no basis to consider the two part of the same development plan, but it is important to distinguish that Intel appears in different technology frameworks at both the system and packaging levels. The details to watch for are the specific process conditions for seed layers and TGVs, performance evaluations of completed packages, and the timing of the transition from prototyping to mass production. The provided materials offer no figures with which to assess yield, throughput or production plans. For now, the fact that the materials were used in a development process should therefore be evaluated separately from their application in commercial products.

Materials from JX Advanced Metals and a group company were reportedly used in seed-layer formation and TGV-related processes for glass-substrate packaging. This is an example of a Japanese materials company participating in multiple stages of packaging processes, but the provided materials do not confirm mass-production adoption or supply volumes.