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Infineon unveils technology to embed 1,200V SiC in PCBs
Infineon unveiled a technology to embed 1,200V SiC MOSFETs in PCBs for electric vehicle inverters.
What happened
ITmedia reported that Infineon unveiled ENDOPACK Cell on October 27, 2026, a technology that directly embeds 1,200V SiC MOSFETs in PCBs. The company said vehicles featuring the technology are expected to enter mass production in 2027.
Sources
Translated from the Japanese original: /news/infineon-1200v-sic-mosfet-wo-pcb-ni-umekomu-endopack-cell-wo-fa04a6. The Japanese version is authoritative if they differ.