Physical AI News (Japan)

Physical AI, robotics and compute — reported from Japan.

日本語
· Product launches· 日本語で読む

congatec Announces COM-HPC Module Powered by AMD Ryzen AI Embedded X100

congatec announced a COM-HPC Client module powered by the AMD Ryzen AI Embedded X100 series.

What happened

On July 23, 2026, congatec announced the conga-HPC/cRX1, a COM-HPC Client Size C module powered by the AMD Ryzen AI Embedded X100 series. It integrates up to 16 Zen 5 CPU cores, an RDNA 3.5 GPU and a dedicated NPU, delivering up to 59 TOPS of AI inference performance.

Why it matters

The module is aimed at designers seeking to combine real-time control, sensor fusion and object detection in a single board for industrial embedded equipment. congatec said the integrated CPU, GPU and NPU can eliminate the need for a separate AI accelerator card in some applications.

Sources

Translated from the Japanese original: /news/congatec-amd-ryzen-ai-embedded-x100-tousai-no-com-hpc-mojuur-88665a. The Japanese version is authoritative if they differ.