Physical AI News (Japan)

Physical AI, robotics and compute — reported from Japan.

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· Product launches· 日本語で読む

KUKA to Demonstrate Packaging Automation Solutions at PACK EXPO 2026

KUKA Robotics announced it will hold live demonstrations of packaging automation at PACK EXPO 2026, which will take place in Chicago in October 2026.

What happened

At booth N-5530 at PACK EXPO 2026 (Oct. 18-21 at McCormick Place in Chicago), KUKA Robotics will present robot demonstrations for real-world applications, including palletizing and case erecting. Partner companies FOCUS Integration, Compendium Group and Acieta will participate.

Why it matters

For plant managers considering automation in packaging and logistics, KUKA will demonstrate palletizing, case erecting and flat case loading in separate demonstrations at PACK EXPO 2026. The company will also show configurations combining autonomous mobile robots and PLC integration software, making it easier to compare how automation can be connected across different process steps.

Sources

Translated from the Japanese original: /news/kuka-pack-expo-2026-de-housou-jidouka-no-raibudemo-wo-shutte-749489. The Japanese version is authoritative if they differ.